Tanoue has held key leadership positions at NEC, including General Manager of Global Mobile Solutions. He is a recognized figure in the Japanese cellular communications ecosystem and currently serves as Senior Advisor in the Product Development Department of OREX SAI, a joint venture between NTT DoCoMo and NEC, focused on promoting Open Radio Access Network (O-RAN) solutions in the global market.

“We are thrilled to welcome Tanoue San to our Advisory Board,” said Manolis Frantzeskakis, CEO and Chairperson of Argo Semiconductors. “His extensive experience in cellular infrastructure, particularly in Radio Access Networks, coupled with his strategic vision, will be instrumental in accelerating the adoption of ArgoSemi’s telecommunication product strategy.

“I am honored to join Argo Semiconductors and am incredibly excited about the opportunities ahead,” said Katsumi Tanoue. “I look forward to collaborating with the ArgoSemi team to advance its mission and drive sustainable growth in the industry.”

About Argo Semiconductors SA

Headquartered in Athens, Greece, ArgoSemi specializes in the design and development of advanced RF solutions for next-generation telecommunications. With a team of seasoned professionals, ArgoSemi delivers cutting-edge active antenna solutions for sub-6GHz 5G cellular networks, setting new industry standards for performance and efficiency.

For media inquiries, please contact:

Foteini Panagiotakopoulou 
Digital Marketing Manager 
📧 Email: foteini@argosemi.com 
📞 Phone: +30-210-699-3609 

following the award of the prestigious European Innovation Council (EIC) Accelerator blended finance support. This funding will support the development of cutting-edge, highly integrated RF Front-End Modules (FEMs) for 5G N78 and N79 applications, improving both financial and environmental attributes and furthering ArgoSemi’s mission to drive technological advancements in cellular communications.

The EIC Accelerator is the funding tool from the Horizon Europe program, that targets the scaling of research and innovation efforts, it aims to address global challenges, support the digital and green transitions, and enhance European competitiveness. ArgoSemi’s project, which focuses on energy-efficient, high-performance RF FEMs, aligns perfectly with the program’s priorities in fostering sustainable and advanced digital infrastructure.

“The official initiation of our EIC supported Active Antenna project marks a significant milestone for ArgoSemi”, said Dr Frantzeskakis, CEO of ArgoSemi. “It validates our commitment to developing innovative RF solutions and strengthens our role in advancing 5G technologies essential for Europe’s digital future.”

ArgoSemi’s advanced, high integration active antenna technology, with innovative RF FEMs are designed to significantly reduce the cost, power consumption, and size of Remote Unit (RU) solutions for 5G networks. These improvements will enable telecom operators to deploy more compact, cost and energy efficient systems, thereby lowering operational expenses and contributing to the sustainability of next-generation communication infrastructures.

The EIC financing will facilitate:
– Accelerated research and development of ArgoSemi’s RF FEMs to enhance data rates, energy efficiency and cost efficiency in 5G networks.
– Collaborations with leading European research institutions and industry partners to ensure technological excellence.
– Contribution to the EU’s goals of technological sovereignty and reduced reliance on non-European semiconductor suppliers.

About ArgoSemi

Headquartered in Athens, Greece, ArgoSemi specializes in the design and development of advanced RF solutions for next-generation telecommunications. With a team of highly experienced professionals, ArgoSemi delivers innovative products that drive the evolution of wireless communication technologies.

Media Contact:

Foteini Panagiotakopoulou

Digital Marketing Manager

Email: foteini@argosemi.com

+30-210-699-3609

The All-in-one Digital antenna module streamlines BOM cost power consumption and time to market for RU developers.
[BARCELONA, Spain, Feb. 20, 2024], Metanoia Communications Inc. (Metanoia), Argo Semiconductors SA (ArgoSemi) and NXP® Semiconductors showcase a groundbreaking Digital Antenna module at the Sub-6 GHz band, encompassing the Digital Front-End processing all the way to signal emission on the air. This is enabled by NXP’s top-side cooled A5M36TG140-TC power amplifier (PA) and Layerscape® Access LA1200 software-defined radio, Metanoia’s 5G Sub-6GHz RF IC (the MT3812) and ArgoSemi’s pioneering 2D printed antenna (the AS04xx product line). This turn-key reference design for 5G small cell radios leverages size, weight and power (SWaP) savings with lower cost, power consumption and development time for both MIMO and massive MIMO deployments. The initial reference design is optimized for 4T4R CBRS outdoor use cases across private networks and MNO deployment extensions, extending to other RF bands and future derivatives with a common PCB footprint. “This innovative reference design will not only minimize customers’ engineering efforts, it will also be a “white module” for different product density, different markets and shorten significantly the time to market for 5G solutions. Metanoia’s MT3812 is a low power, cost-effective tri-band 2T/2R IC with extensive software library to help customers with all the aspects of RF calibration, product manufacturing and implementation.” explains Didier Boivin, Metanoia EVP. “ArgoSemi is happy to contribute its breakthrough high-performance 2D printed antenna AS0424 allowing the complete integration of all the Digital Antenna components directly onto the antenna PCB and thus eliminate connectors losses boosting the Digital Antenna gain” explained Dr. Manolis Frantzeskakis, CEO of ArgoSemi. “This Digital Antenna module features NXP’s industry-first top-side cooled package, opening up new markets for O-RAN equipment makers, simplifying their design work and reducing material costs and manufacturing complexity for fast-time-to-market,” says Jeff Steinheider, Vice President and General Manager, Industrial Edge Processing, at NXP. About Metanoia Metanoia based in Hsinchu, Taiwan has contributed to the development of several generations of semiconductor SoC solutions for wireline Broadband and is now focusing in bringing new products to the 5G NR Markets.

About ArgoSemi
Argo Semiconductors SA, headquartered in Athens, Greece is an RF subsystem innovator with
long experience on radio solutions, presently leveraging its compact 2-D antenna arrays at
Sub-6GHz for plain MIMO and massive MIMO radios in 5G and beyond.
For more information, please visit: www.argosemi.com/digital-antenna